23 March 1986 Three Dimensional Integrated Circuits Using Optical Interconnects
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Abstract
A three dimensional architecture is described using optical sources and detectors to interconnect integrated circuit layers. By stacking circuit planes and communicating through optical vias, substantial savings are realized in volume and cost along with increases in density and speed. Highly parallel architectures and efficient hardware for array processing are now possible using technologies that are rapidly becoming practical and available.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tracy D. McSheery, Tracy D. McSheery, "Three Dimensional Integrated Circuits Using Optical Interconnects", Proc. SPIE 0698, Real-Time Signal Processing IX, (23 March 1986); doi: 10.1117/12.976270; https://doi.org/10.1117/12.976270
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