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11 August 1987 A High Fiber Density Optical Connector For Use In Electronic Packaging Systems
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Proceedings Volume 0752, Digital Optical Computing; (1987)
Event: OE LASE'87 and EO Imaging Symposium, 1987, Los Angeles, CA, United States
A through-the-backplane, circuit pack optical connector, utilizing a novel alignment mechani3m, is described. Up to 13 fibers can be interconnected in a space of 0.5" x 0.6" x 2.26". Average loss is 0.53 dB with 50/125 fiber. Laboratory tests with single mode fiber (8.3/125) in a modified connector have shown an average loss of about 0.7dB. All measurements were made without index matching material.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. J. Parzygnat "A High Fiber Density Optical Connector For Use In Electronic Packaging Systems", Proc. SPIE 0752, Digital Optical Computing, (11 August 1987);


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