11 August 1987 A High Fiber Density Optical Connector For Use In Electronic Packaging Systems
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Proceedings Volume 0752, Digital Optical Computing; (1987) https://doi.org/10.1117/12.939930
Event: OE LASE'87 and EO Imaging Symposium, 1987, Los Angeles, CA, United States
Abstract
A through-the-backplane, circuit pack optical connector, utilizing a novel alignment mechani3m, is described. Up to 13 fibers can be interconnected in a space of 0.5" x 0.6" x 2.26". Average loss is 0.53 dB with 50/125 fiber. Laboratory tests with single mode fiber (8.3/125) in a modified connector have shown an average loss of about 0.7dB. All measurements were made without index matching material.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. J. Parzygnat, W. J. Parzygnat, } "A High Fiber Density Optical Connector For Use In Electronic Packaging Systems", Proc. SPIE 0752, Digital Optical Computing, (11 August 1987); doi: 10.1117/12.939930; https://doi.org/10.1117/12.939930
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