Applications Of The Mold Controlled Profile (MCP) Technique For Resist Processing

Burn J. Lin

doi:10.1117/12.940324

25 August 1987 Applications Of The Mold Controlled Profile (MCP) Technique For Resist Processing

Burn J. Lin

Proceedings Volume 0771, Advances in Resist Technology and Processing IV; (1987) https://doi.org/10.1117/12.940324
Event: Microlithography Conferences, 1987, Santa Clara, CA, United States

Abstract

The Mold Controlled Profile (MCP) technique consists of coating a layer of immiscible polymer over a prepatterned resist image. This structure can be heated to an extremely high temperature without lateral distortion of the original resist profile, while the patterned resist undergoes significant chemical changes. After removal of the mold, the resultant image can be used in many areas of application. Here, the hardening aspect and the compensation of interfacial layer in the capped deep-uv Portable Conformable Masking (PCM) system are given to demonstrate the advantages of the MCP technique and to stimulate other new applications.

Citation Download Citation

Burn J. Lin "Applications Of The Mold Controlled Profile (MCP) Technique For Resist Processing", Proc. SPIE 0771, Advances in Resist Technology and Processing IV, (25 August 1987); https://doi.org/10.1117/12.940324

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