25 August 1987 Optimized Tri-Layer Resist Technique For Volume Production
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Tri-layer resist technique has been developed for volume production of VLIs to achieve 0.8 μm line and space pattern using an NA 0.35 stepper. The 0.8 μm feature process was done mostly by optimizing normality of developer for top-layer resist. Patterned resolution dep-ends strongly on normality of the developer. The lower normality gives much wider latitude to CD control. Possibility of application of tri-layer resist process whose structure consists of top-layer resist, middle-layer silicone resine, and underlayer resist was examined.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
E. Kawamura, E. Kawamura, J. Konno, J. Konno, K. Inayoshi, K. Inayoshi, T. Takada, T. Takada, } "Optimized Tri-Layer Resist Technique For Volume Production", Proc. SPIE 0771, Advances in Resist Technology and Processing IV, (25 August 1987); doi: 10.1117/12.940339; https://doi.org/10.1117/12.940339


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