Spin Coating And Planarization

Larry E. Stillwagon; Ronald G. Larson; Gary N. Taylor

doi:10.1117/12.940325

25 August 1987 Spin Coating And Planarization

Larry E. Stillwagon, Ronald G. Larson, Gary N. Taylor

Proceedings Volume 0771, Advances in Resist Technology and Processing IV; (1987) https://doi.org/10.1117/12.940325
Event: Microlithography Conferences, 1987, Santa Clara, CA, United States

Abstract

This paper reports the results of a study of topographic substrate planarization with films applied by a spin-coating process. We show that spin coating produces conformal film profiles over gaps on the substrate with widths greater than about 50 pm and that filling of these gaps can only occur after spinning has ceased provided the film is able to flow over large distances. A comparison of the major forces acting on the film leads to the conclusion that the flow is driven primarily by capillary forces when the width of the gap is less than 5000 μm. A theory is developed that relates the time required to fill the gaps to their width and to the thickness and viscosity of the film. The results of experiments performed to test the theory are presented and discussed.

Citation Download Citation

Larry E. Stillwagon, Ronald G. Larson, and Gary N. Taylor "Spin Coating And Planarization", Proc. SPIE 0771, Advances in Resist Technology and Processing IV, (25 August 1987); https://doi.org/10.1117/12.940325

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