1 January 1987 Application Specific Wafer Stepper
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Overlay, throughput and lens performance are three critical parameters of optical alignment equipment. High overlay accuracy will give high die yields for alignment sensitive parts or can allow designers to use tighter design rules which will allow a shrink of the chip and more chips per wafer. This work contains high overlay accuracy data obtained during the processing of production wafer lots of a 64K HRAM (Hierarchical RAM) device using an ASM Lithography PAS 2000 Wafer Stepper.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dick Fallon, James R. Shih, "Application Specific Wafer Stepper", Proc. SPIE 0772, Optical Microlithography VI, (1 January 1987); doi: 10.1117/12.967052; https://doi.org/10.1117/12.967052


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