The performance of micron and submicron devices and chips for the coming decade is advancing at a rapid pace. The requirements to test these ultrafast, small, and dense circuits give rise to great challenges for high speed testing. Methodology to meet these challenges and yet unsolved forthcoming problems are discussed.
"High Speed Device Testing And Internal Node Diagnostics", Proc. SPIE 0774, Lasers in Microlithography, (1 September 1987); doi: 10.1117/12.940385; https://doi.org/10.1117/12.940385