1 September 1987 Laser Linking For Defect Avoidance And Customization
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Abstract
A laser linking technology has been developed which allows the formation of connections after fabrication in order to circumvent defects for yield enhancement in wafer-scale silicon circuits. This technique also facilitates rapid-turnaround customization. A number of digital signal processing systems have now been implemented with applications to speech, radar and image processing. In order to expedite technology transfer a new link structure has been developed which can be fabricated using a standard MOS process and has been demonstrated using the MOSIS silicon foundry.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. I. Raffel, J. I. Raffel, } "Laser Linking For Defect Avoidance And Customization", Proc. SPIE 0774, Lasers in Microlithography, (1 September 1987); doi: 10.1117/12.940393; https://doi.org/10.1117/12.940393
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