1 September 1987 Laser Processing For Application Specific Integrated Circuits (ASICs)
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ASIC devices can be programmed by lasers using two techniques - a photochemical approach to direct-write connections or localized heating of the circuits by a laser spot to cut or form link structures. The technique to cut links is a mature process based on cutting similar link structures used to repair memory devices with redundant circuitry. The link-cutting process described here provides a 90% or higher programming yield on a 100,000 link ASIC based on specific process recommendations including optical verification of link cutting performance.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Donald V. Smart, Donald V. Smart, Donald M. Stewart, Donald M. Stewart, } "Laser Processing For Application Specific Integrated Circuits (ASICs)", Proc. SPIE 0774, Lasers in Microlithography, (1 September 1987); doi: 10.1117/12.940392; https://doi.org/10.1117/12.940392


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