1 September 1987 Laser Processing For Application Specific Integrated Circuits (ASICs)
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ASIC devices can be programmed by lasers using two techniques - a photochemical approach to direct-write connections or localized heating of the circuits by a laser spot to cut or form link structures. The technique to cut links is a mature process based on cutting similar link structures used to repair memory devices with redundant circuitry. The link-cutting process described here provides a 90% or higher programming yield on a 100,000 link ASIC based on specific process recommendations including optical verification of link cutting performance.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Donald V. Smart, Donald M. Stewart, "Laser Processing For Application Specific Integrated Circuits (ASICs)", Proc. SPIE 0774, Lasers in Microlithography, (1 September 1987); doi: 10.1117/12.940392; https://doi.org/10.1117/12.940392


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