17 April 1987 A Contactless 3-D Measuring Technique For IC Inspection
Author Affiliations +
Proceedings Volume 0775, Integrated Circuit Metrology, Inspection, & Process Control; (1987); doi: 10.1117/12.940417
Event: Microlithography Conferences, 1987, Santa Clara, CA, United States
Digital filtering techniques have been combined with a scanning electron microscope to provide noise free, TV rate stereo images over the full magnification range of the SEM, giving a qualitative pseudo 3-D representation of the sample surface. In this paper, a development of this technique will be described which permits quantitative measurement of a surface in 3 dimensions. Image correlation techniques have been derived which, when coupled with the lens controls of the SEM in the form of a feedback loop, permit automatic profiling of small structures. The technique has potential applications to a range of integrated circuit inspection techniques including resist profiling and critical dimension measurements.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bernard C. Breton, John T . L . Thong, William C. Nixon, "A Contactless 3-D Measuring Technique For IC Inspection", Proc. SPIE 0775, Integrated Circuit Metrology, Inspection, & Process Control, (17 April 1987); doi: 10.1117/12.940417; http://dx.doi.org/10.1117/12.940417


Scanning electron microscopy

Digital filtering

Integrated circuits


Process control

Image resolution

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