22 April 1987 Transient-Enhanced Diffusion In Ion-Implanted Silicon
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Proceedings Volume 0797, Advanced Processing of Semiconductor Devices; (1987) https://doi.org/10.1117/12.941027
Event: Advances in Semiconductors and Semiconductor Structures, 1987, Bay Point, FL, United States
We discuss the transient-enhanced diffusion of Sb, As, P, In, Ga, and B in ion-implanted Si, where the near-surface region has been amorphized by the dopant or by a self-implantation process. With Sb, a large transient diffusion enhancement is observed proportional to dopant concentration. For Sb, As, P, and In, the enhancement follows the relative interstitialcy diffusion coefficient. We believe this behavior is caused by stable implantation-induced point defects present in the amorphous surface layer, which decay during thermal processing to release high concentrations of self interstitials. This process occurs in competition with the solid phase epitaxial (SPE) growth process, and for high dopant concentrations can occur in the amorphous phase ahead of the crystallization front. We believe this may be the origin of the dopant redistribution which can occur during SPE growth, which sets the upper limit to the dopant concentration which can be incorporated in the lattice by SPE growth. These effects are reduced for Ga and are absent for B, although transient enhanced diffusion of these species can still occur from defects emitted from the damaged crystal underlying the original amorphous/crystalline interface.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. J. Pennycook, S. J. Pennycook, R. J. Culbertson, R. J. Culbertson, } "Transient-Enhanced Diffusion In Ion-Implanted Silicon", Proc. SPIE 0797, Advanced Processing of Semiconductor Devices, (22 April 1987); doi: 10.1117/12.941027; https://doi.org/10.1117/12.941027

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