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1 January 1987 A High Performance Packaging Technology To Match Optical Transmission
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Proceedings Volume 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects; (1987)
Event: Cambridge Symposium on Fiber Optics and Integrated Optoelectronics, 1987, Cambridge, MA, United States
To even attempt to match the bandwidth capability of fiber optic transmission, electronics must be designed with the fastest chips and the next generation packaging- the multichip module. While individual chip packages are a convenience for testing and in handling with clumsy fingers, they are detrimental to system performance. They demand long path lengths, frequently using materials of high dielectric constant, and often create impedance mismatches. The next generation multichip substrates developed and manufactured by Raychem Corporation, cut path lengths typically 4 :1 and allow interconnect densities of more than 500 in/ of board. They are constructed from multilayer thin film metal lines less than 25μ wide and a polymer insulation. The precision thin film technique provides chip attach footprints that can match the chip I/O, resulting in low bonding parasitics. The electrical properties are very well described by traditional models for planar interconnects, and agree with the actual measurements up to 10 GHz, the limit of reliable data. These generic substrates will help bridge the "impedance mismatch" between the transmission bandwidth of fibers and the information exchange bandwidth of digital electronics.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eric Bogatin and Paul Sherlock "A High Performance Packaging Technology To Match Optical Transmission", Proc. SPIE 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects, (1 January 1987);

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