1 January 1987 Multiple Fiber Interconnect Using Silicon V-Grooves
Author Affiliations +
Proceedings Volume 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects; (1987) https://doi.org/10.1117/12.967544
Event: Cambridge Symposium on Fiber Optics and Integrated Optoelectronics, 1987, Cambridge, MA, United States
A new interconnect method for multiple fibers is reported. The design concept proposes novel silicon components to align and position multifiber subassemblies, which have V-grooves to capture either fiber ribbon or monocoated fibers. The silicon components are fabricated by using preferential crystallographic etching techniques. This approach differs from earlier efforts, as preferential etching of silicon is used not only for the fiber placement, but for array alignment as well. Preliminary results are presented to demonstrate the concept.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
P. C. Chang, P. C. Chang, S. Sriram, S. Sriram, A. C. Wey, A. C. Wey, } "Multiple Fiber Interconnect Using Silicon V-Grooves", Proc. SPIE 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects, (1 January 1987); doi: 10.1117/12.967544; https://doi.org/10.1117/12.967544


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