Translator Disclaimer
3 October 1988 Infrared Thermography As An Aid In Quantitative Reliability And Risk Analyses
Author Affiliations +
Proceedings Volume 0918, Applications of Infrared Technology; (1988) https://doi.org/10.1117/12.945601
Event: Sira/SPIE Infrared Meeting, 1988, London, United Kingdom
Abstract
An attempt is made to show how Infrared Thermography may effectively aid in yielding realistic assessments of both hardware and human reliability parameters, such as failure/ error rates, corresponding to working conditions actually sensitive to and/or reflected in the existing thermal environment, which usually are not explicitly and specifically accounted for in current quantitative reliability and risk analyses. An analysis, emphasizing first principles and measurable phenomena, is made conducive to characterize specific functional relationships between the relevant thermal patterns and those reliability parameters which may lead to the actual assessment of the latter. The application of this analysis to fault/failure mode diagnosis, and both preventive maintenance and risk analysis is also addressed.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Angel Madrid "Infrared Thermography As An Aid In Quantitative Reliability And Risk Analyses", Proc. SPIE 0918, Applications of Infrared Technology, (3 October 1988); https://doi.org/10.1117/12.945601
PROCEEDINGS
21 PAGES


SHARE
Advertisement
Advertisement
Back to Top