1 January 1988 A New Silicone-Based Positive Photoresist (SPP) For A Two-Layer Resist System
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A new silicone-based positive photoresist(SPP), composed of an alkali-soluble silicone polymer with diazonaphthoquinone, is developed. The sensitivity of SPP to near-uv light is almost the same as that of conventional photoresist(OFPR). SPP shows high dry-etching durability to 02 RIE. The etching rate ratio of SPP to OFPR is over 20. This high dry-etching durability allows the fabrication of thick OFPR resist patterns using an SPP pattern mask. A 0.6 μm line and space is clearly resolved in an SPP/OFPR resist system when exposed to a GCA stepper (NA=0.38)
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Saburo Imamura, Saburo Imamura, Akinobu Tanaka, Akinobu Tanaka, Katsuhide Onose, Katsuhide Onose, } "A New Silicone-Based Positive Photoresist (SPP) For A Two-Layer Resist System", Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); doi: 10.1117/12.968330; https://doi.org/10.1117/12.968330

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