1 January 1988 Silicon-Added Bilayer Resist (SABRE) System
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A new silylated resist process has been developed that provides the advantages of trilayer photoresist processing in a simpler bilayer format. In this new process, silicon for oxygen plasma etch resistance is added to a conventional photoresist layer after it has been exposed and developed. This silylated resist image provides an etch mask for 02 RIE etching of an underlying organic planarizing layer with 15:1 selectivity, vertical profiles, and high resolution. The process is positive-working, uses conventional materials, and improves the thermal stability of the resist image.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
William C. McColgin, Robert C. Daly, Joseph Jech, Thomas B. Brust, "Silicon-Added Bilayer Resist (SABRE) System", Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); doi: 10.1117/12.968327; https://doi.org/10.1117/12.968327

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