1 January 1988 Silicon-Added Bilayer Resist (SABRE) System
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A new silylated resist process has been developed that provides the advantages of trilayer photoresist processing in a simpler bilayer format. In this new process, silicon for oxygen plasma etch resistance is added to a conventional photoresist layer after it has been exposed and developed. This silylated resist image provides an etch mask for 02 RIE etching of an underlying organic planarizing layer with 15:1 selectivity, vertical profiles, and high resolution. The process is positive-working, uses conventional materials, and improves the thermal stability of the resist image.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
William C. McColgin, William C. McColgin, Robert C. Daly, Robert C. Daly, Joseph Jech, Joseph Jech, Thomas B. Brust, Thomas B. Brust, "Silicon-Added Bilayer Resist (SABRE) System", Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); doi: 10.1117/12.968327; https://doi.org/10.1117/12.968327

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