1 January 1988 First Results Of A Product Utilizing Coherence Probe Imaging For Wafer Inspection
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A description of a new product, the first to utilize Coherence Probe Imaging, is given, and application results are presented. In Coherence Probe Imaging, data from an interference microscope is transformed by means of a nonlinear transformation implemented electronically to produce three dimensional images of higher resolution than an ordinary microscope. Because of the parallel nature of the image acquisition, conventional light sources can be used for illumination. Critical dimension or linewidth data analysis is presented. Comparisons to scanning electron microscope measurement are made. Typical linewidth reports are shown. Illustrative reports from the layer to layer misregistration measurement function of the machine is also shown. The coherence probe technique is used to make extended depth of focus pictures and z maps showing topographical detail. Sample images showing these features are shown. Automation features of the machine are also described, such as the automatic wafer alignment system on the machine and the random access robotic wafer handling system.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mark Davidson, Mark Davidson, Kalman Kaufman, Kalman Kaufman, Isaac Mazor, Isaac Mazor, "First Results Of A Product Utilizing Coherence Probe Imaging For Wafer Inspection", Proc. SPIE 0921, Integrated Circuit Metrology, Inspection, and Process Control II, (1 January 1988); doi: 10.1117/12.968357; https://doi.org/10.1117/12.968357


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