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14 June 1988 A New Electron Beam/Deep Ultra Violet (EB/DUV) Cyanoacrylate Resist Technology
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Abstract
This paper describes a vapour coating technique for depositing polycyanoacrylate films up to 8um thick on semiconductor substrates. These films are suitable for use as EB/DUV resists and we present their measured characteristics. Vapour-deposited films have better plasma etching resistance than similar spun-on films.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W M Kelly, A Doyle, E. Noonan, J Woods, and J Rooney "A New Electron Beam/Deep Ultra Violet (EB/DUV) Cyanoacrylate Resist Technology", Proc. SPIE 0923, Electron-Beam, X-Ray, and Ion Beam Technology: Submicrometer Lithographies VII, (14 June 1988); https://doi.org/10.1117/12.945654
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