14 June 1988 Novel Process For Fabricating Low Distortion X-Ray Masks Of Submicron Gold Patterns
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Abstract
A novel process for fabricating x-ray masks of submicron gold patterns using a copper plating base is presented and discussed in detail. In the E-beam writing of x-ray masks, the trilevel resist layers and the metal layer for x-ray absorber patterning cause a proximity effect which determines the masks' resolution. Based on E-beam simulations and experimental results, copper plating base is selected as the best metal-layer material to reduce the above effect. To fabricate submicron gold patterns on the copper base, two gold-electroplating steps are newly introduced. These are strike plating and pulse-current plating. Stress change in the plated gold and positional accuracy changes are also measured throughout the heating process. Finally, sequential steps for the fabrication of x-ray masks with plating base are shown.
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Shinji Kuniyoshi, Shinji Kuniyoshi, Akihiko Kishimoto, Akihiko Kishimoto, Taroh Ogawa, Taroh Ogawa, Takashi Soga, Takashi Soga, Takeshi Kimura, Takeshi Kimura, } "Novel Process For Fabricating Low Distortion X-Ray Masks Of Submicron Gold Patterns", Proc. SPIE 0923, Electron-Beam, X-Ray, and Ion Beam Technology: Submicrometer Lithographies VII, (14 June 1988); doi: 10.1117/12.945649; https://doi.org/10.1117/12.945649
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