Infrared Thermal Testing Of Mechanical Assemblies At The Military Depot And Field Level: A Progress Report

Herbert Kaplan

doi:10.1117/12.968503

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1 January 1988 Infrared Thermal Testing Of Mechanical Assemblies At The Military Depot And Field Level: A Progress Report

Herbert Kaplan

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Proceedings Volume 0934, Thermosense X: Thermal Infrared Sensing for Diagnostics and Control; (1988) https://doi.org/10.1117/12.968503
Event: 1988 Technical Symposium on Optics, Electro-Optics, and Sensors, 1988, Orlando, FL, United States

Abstract

Based on encouraging results on the Army's programs for infrared mass screening of printed circuit boards at the depot level, the US Army CECOM (Communication-Electronics Command) undertook a one-year investigation of the applicability of similar techniques to screening and diagnostics of mechanical assemblies. These included tanks, helicopters, transport vehicles and their major subassemblies (transmissions, engines, axles, etc.) at field and depot levels. Honeyhill Technical Company was tasked to classify candidate assemblies and perform preliminary measurements using Army-owned general-purpose thermal imaging equipment. The investigations yielded positive results, and it was decided to pursue a comprehensive measurements program using field-mobile equipment specifically procured for the program. This paper summarizes the results of the investigations, outlines the measurements techniques utilized, describes the classification and selection of candidate assemblies, and reports on progress toward the goals of the program.

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Herbert Kaplan "Infrared Thermal Testing Of Mechanical Assemblies At The Military Depot And Field Level: A Progress Report", Proc. SPIE 0934, Thermosense X: Thermal Infrared Sensing for Diagnostics and Control, (1 January 1988); https://doi.org/10.1117/12.968503

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