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29 January 1989 Low Stress, Vacuum - Chuck Mounting Techniques For The Diamond Machining Of Thin Substrates
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Abstract
Commercially available diamond turning machines offer high levels of accuracy where the full potential of the machine is realised. Unfortunately, surface form accuracy and roughness are dependent on the limiting stiffness of the machine/workpiece environment. Vacuum chuck methods offer a high degree of stiffness combined with the opportunity of mounting substrates in a stress free manner. Thin substrates (4-12 mm) are relatively easily stressed and the application of vacuum chuck mounting for such components, present many problems. These include deformations due to internal material stress, vibration, and the print-through effect. We have measured the reproducability of deformations caused by the print-through effect and have developed techniques for its elimination. The feasibility of using this print-through mechanism for machining non-rotationally symmetric forms is also discussed.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
A. R Hedges and R A Parker "Low Stress, Vacuum - Chuck Mounting Techniques For The Diamond Machining Of Thin Substrates", Proc. SPIE 0966, Advances in Fabrication and Metrology for Optics and Large Optics, (29 January 1989); https://doi.org/10.1117/12.948045
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