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9 February 1989 Vertical Fiber Coupling For High-Density Optical Interconnection
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Abstract
A GaAs/AIGaAs fiber-optic interconnect structure for high-density applications is discussed. The vertical approach, which employs reactive-ion-etched cavities to couple fibers to the semiconductor substrate, permits interconnect arrays with densities up to 1600 sites/cm2. Factors affecting the applicability of the fiber coupler and the achievable packing density are considered.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. W. Ade, E. R. Fossum, and M. A. Tischler "Vertical Fiber Coupling For High-Density Optical Interconnection", Proc. SPIE 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II, (9 February 1989); https://doi.org/10.1117/12.960107
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