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17 January 1989 Packaging Techniques For Broadband Microwave Optoelectronic Components
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Proceedings Volume 0995, High Frequency Analog Communications; (1989) https://doi.org/10.1117/12.960143
Event: O-E/Fiber LASE '88, 1988, Boston, MA, United States
Abstract
Fiber-coupled diode laser and photodiode microwave packages with performance extending to 20 GHz have been developed. A microwave transmission loss of 32 dB and relative intensity noise of less than -140 dB/Hz were measured at 1.3 μm wavelength.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Schlafer and L. Ulbricht "Packaging Techniques For Broadband Microwave Optoelectronic Components", Proc. SPIE 0995, High Frequency Analog Communications, (17 January 1989); https://doi.org/10.1117/12.960143
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