8 August 1977 Projection Printing Characterization
Author Affiliations +
Abstract
Projection printing eliminates the problems introduced by hard-contacting the mask to the wafer while maintaining the high resolution requirements of the integrated circuit manufacturer. Certain advantages of projection printing are obvious: the wafers are not contaminated or damaged by contact with the mask, and the mask will not wear out. Less obvious are the steps required to maximize the advantages of projection printing, thereby reducing costs and increasing yields. This paper considers photoresist choices, suggests some procedures to determine process variables, and discusses mask costs and quality effects.
© (1977) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John W. Bossung, "Projection Printing Characterization", Proc. SPIE 0100, Developments in Semiconductor Microlithography II, (8 August 1977); doi: 10.1117/12.955357; https://doi.org/10.1117/12.955357
PROCEEDINGS
6 PAGES


SHARE
RELATED CONTENT

Ultrathick Photoresist Processing
Proceedings of SPIE (September 05 1980)
Increasing The Functional Speed Of Positive Photoresist
Proceedings of SPIE (August 08 1977)
Masking With Matched Sets
Proceedings of SPIE (September 20 1976)
Double exposure for the contact layer of the 65 nm...
Proceedings of SPIE (May 04 2005)

Back to Top