30 June 2016 ISERM: in-situ etch rate measurement system
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Proceedings Volume 10009, Third European Seminar on Precision Optics Manufacturing; 100090N (2016) https://doi.org/10.1117/12.2236642
Event: Third European Seminar on Precision Optics Manufacturing, 2016, Teisnach, Germany
Abstract
The in-situ etch rate measurement system (ISERM) has not just been developed to bring the automation process of an IBF plant to the next level, but to add another possibility of control for the ion beam and therefore characterize the tool of the plant. Thus far a dummy sample must be used on which footprints and grooves must be generated by the ion beam tool. To determine the etch rate and the shape of the ion beam the sample needs to be measured with a surface interferometer afterward. This is a time intensive and static process and has to be redone in case of changing process parameters, e.g. ion source parameter settings. The ISERM is capable of automatically and repeatedly determining the etch rate and the shape of the ion beam without the need of processing a dummy sample.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. Gürtler, S. Gürtler, M. Georges, M. Georges, C. Schikora, C. Schikora, } "ISERM: in-situ etch rate measurement system", Proc. SPIE 10009, Third European Seminar on Precision Optics Manufacturing, 100090N (30 June 2016); doi: 10.1117/12.2236642; https://doi.org/10.1117/12.2236642
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