The thermal micro pipes which were aimed to the cooling of the electrical systems, were realized until the present day in different constructive ways. If the first thermal pipes had had at the base the thermo-siphon system , afterwards it had been developed the thermal micro pipes , thanks to their increased capacity of heat dissipation of the surfaces covered by big densities of the thermal flow. The article, presents in the first part, the physical characteristics of the elements which embody a thermal micro pipe and which generates an excess of liquid. For this it has been realized an experimental setup. Measurements were taken by aid of a laser profilometer of the coverage material in two cases. The first one considered the material without being soaked in the liquid, and for the second one, the measurements were taken when the material was supersaturated with liquid. Since the setup allows for temperature monitoring, determinations were effectuated in the vaporization, adiabatic and condensation areas. The temperature field was determined along a thermal micro pipe in the case of extra fluid. The experimental determinations allowed verifying if the method proposed by Mihai and Olariu , for cooling of the electronic components, through a semi active method with the share of extra fluid in the vaporization area of the thermal micro pipe, works. It was studied how the temperature modifies in the vaporization and condensation areas and by the contrast of the theoretical results obtained through the evaluation with the experimental ones.