9 November 2016 W/Cu joining strengthened by femtosecond laser-induced micron-scale interface structure
Author Affiliations +
W/Cu joining is key for the fabrication of high heat load components for fusion reactors, which however suffers from the low W/Cu bonding strength due to the immiscible nature of W-Cu system. In this study, we proposed a method for strengthened W/Cu joining based on femtosecond (fs) laser induced micron-scale W/Cu interface structure. W surfaces were irradiated by fs laser to form micron-scale cubes array, and then joined to Cu by hot pressing at 1000 °C, 80 MPa for 2.5 hours. The tensile strength of the W/Cu joining samples was investigated. The results show that micron-scale cubes array was successfully introduced into W/Cu interface without any cracks or pores. The interface structure helps to increase the W/Cu bonding strength to as high as 59.61 MPa, increased by about 50% as compared to W/Cu joining with a flat interface (bonding strength 40.11 MPa). The W/Cu bonding strength shows positive correlation with the W/Cu interface area, indicating the possibility to control the W/Cu bonding strength by simply adjusting the fs laser ablation parameters for the fabrication of cubes array on W surface. Our research provides a method for strengthened joining between intrinsically immiscible materials, including but not limited to W and Cu.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dafa Jiang, Dafa Jiang, Dingwei Gong, Dingwei Gong, Jiangyou Long, Jiangyou Long, Peixun Fan, Peixun Fan, Hongjun Zhang, Hongjun Zhang, Minlin Zhong, Minlin Zhong, } "W/Cu joining strengthened by femtosecond laser-induced micron-scale interface structure", Proc. SPIE 10018, Advanced Laser Processing and Manufacturing, 1001805 (9 November 2016); doi: 10.1117/12.2246201; https://doi.org/10.1117/12.2246201

Back to Top