28 September 2016 Thermal and electrical comparison of different joining techniques
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Proceedings Volume 10031, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2016; 1003107 (2016) https://doi.org/10.1117/12.2248619
Event: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2016, 2016, Wilga, Poland
Abstract
After the enforcement of Restriction of Hazardous Substances Directive, one of the biggest problems in electronics is finding a substitution for led solders. Meanwhile, working conditions for the electronics are tougher and tougher – the temperatures the joints have to withstand can be much higher than working temperatures of the soft solders. In current article, the authors present the Low Temperature Joining Technique (LTJT) with the use of pastes based on the mixture of silver nanoparticles and silver microflakes. The authors also show the technology of joining, justify their sintering parameters selection and compare their silver joints with Pb solder and adhesive. The joints prepared with pastes containing silver nanoparticles have much better electrical and thermal properties than the ones made with other techniques.
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J. Szałapak, K. Kiełbasiński, J. Krzemiński, R. Pawłowski, M. Jakubowska, "Thermal and electrical comparison of different joining techniques", Proc. SPIE 10031, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2016, 1003107 (28 September 2016); doi: 10.1117/12.2248619; https://doi.org/10.1117/12.2248619
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