21-22 June 2016
Dresden, Germany
Front Matter: Volume 10032
Proc. SPIE 10032, Front Matter: Volume 10032, 1003201 (20 October 2016); https://doi.org/10.1117/12.2264270
Wafer Lithography
Proc. SPIE 10032, Improving contact layer patterning using SEM contour based etch model, 1003202 (20 October 2016); https://doi.org/10.1117/12.2248013
Proc. SPIE 10032, A thick photoresist process for high aspect ratio MEMS applications, 1003203 (20 October 2016); https://doi.org/10.1117/12.2247899
Mask Patterning, Metrology and Process
Proc. SPIE 10032, Advanced photomask fabrication by e-beam lithography for mask aligner applications, 1003204 (20 October 2016); https://doi.org/10.1117/12.2248545
Proc. SPIE 10032, Mask manufacturing of advanced technology designs using multi-beam lithography (Part 1), 1003205 (20 October 2016); https://doi.org/10.1117/12.2247941
Proc. SPIE 10032, A parallel multibeam mask writing method and its impact on data volumes, 1003206 (20 October 2016); https://doi.org/10.1117/12.2248449
Proc. SPIE 10032, Towards expanding megasonic cleaning capability, 1003207 (20 October 2016); https://doi.org/10.1117/12.2248594
Novel Approaches
Proc. SPIE 10032, The future of 2D metrology for display manufacturing , 1003208 (20 October 2016); https://doi.org/10.1117/12.2248951
Proc. SPIE 10032, Control the light where you need it: new development in accurate delivery of visible laser light, 1003209 (20 October 2016); https://doi.org/10.1117/12.2249030
Proc. SPIE 10032, Illumination pupil optimization in 0.33NA EUVL by intensity balancing for semi-iso dark field two-bar M1 building blocks , 100320A (20 October 2016); https://doi.org/10.1117/12.2248743
Proc. SPIE 10032, Anamorphic imaging at high-NA EUV: mask error factor and interaction between demagnification and lithographic metrics, 100320B (20 October 2016); https://doi.org/10.1117/12.2250630
Proc. SPIE 10032, High performance gratings for DFB lasers fabricated by direct-write e-beam lithography, 100320C (20 October 2016); https://doi.org/10.1117/12.2248862
Proc. SPIE 10032, Photonic integrated circuits: new challenges for lithography, 100320D (20 October 2016); https://doi.org/10.1117/12.2248325
Nano-Imprint Lithography
Proc. SPIE 10032, Nanoimprint system development and status for high volume semiconductor manufacturing, 100320E (20 October 2016); https://doi.org/10.1117/12.2248363
Proc. SPIE 10032, SCIL nanoimprint solutions: high-volume soft NIL for wafer scale sub-10nm resolution, 100320F (20 October 2016); https://doi.org/10.1117/12.2246787
Modeling and Computational Process Correction
Proc. SPIE 10032, Enhancing EUV mask blanks usability through smart shift and blank-design pairing optimization, 100320G (20 October 2016); https://doi.org/10.1117/12.2250106
Using the Data
Proc. SPIE 10032, Translation of lithography variability into after-etch performance: monitoring of golden hotspot, 100320H (20 October 2016); https://doi.org/10.1117/12.2249565
Proc. SPIE 10032, Smart mask ship to control for enhanced on wafer CD performance, 100320I (20 October 2016); https://doi.org/10.1117/12.2248889
More than Moore, IoT, and Manufacturing Challenges
Proc. SPIE 10032, CHAM: weak signals detection through a new multivariate algorithm for process control, 100320J (20 October 2016); https://doi.org/10.1117/12.2248737
Poster Session: Wafer Litho
Proc. SPIE 10032, SRAF insertion for VIA-like layers using laSRAF method, 100320K (20 October 2016); https://doi.org/10.1117/12.2248015
Poster Session: EUV Lithography
Proc. SPIE 10032, Researching new EUV pellicle films for source powers beyond 250 watts, 100320L (20 October 2016); https://doi.org/10.1117/12.2255040
Poster Session: Nano-Imprint Lithography
Proc. SPIE 10032, Critical dimension uniformity characterization of nanoimprinted trenches for high volume manufacturing qualification, 100320M (20 October 2016); https://doi.org/10.1117/12.2250194
Poster Session: Modeling and Computational Process Correction
Proc. SPIE 10032, Bayesian analysis for OPC modeling with film stack properties and posterior predictive checking, 100320N (20 October 2016); https://doi.org/10.1117/12.2249680
Poster Session: Using the Data, More than Moore, IoT, and Manufacturing Challenges
Proc. SPIE 10032, A study of SU-8 photoresist in deep trenches for silicon-embedded microinductors, 100320O (20 October 2016); https://doi.org/10.1117/12.2247894
Proc. SPIE 10032, Industrial implementation of spatial variability control by real-time SPC, 100320P (20 October 2016); https://doi.org/10.1117/12.2249567
Proc. SPIE 10032, Combination of direct laser writing and soft lithography molds for combined nano- and microfabrication, 100320Q (20 October 2016); https://doi.org/10.1117/12.2248219
Proc. SPIE 10032, CD process control through machine learning , 100320R (20 October 2016); https://doi.org/10.1117/12.2248903
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