20 October 2016 The future of 2D metrology for display manufacturing
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Proceedings Volume 10032, 32nd European Mask and Lithography Conference; 1003208 (2016) https://doi.org/10.1117/12.2248951
Event: 32nd European Mask and Lithography Conference, 2016, Dresden, Germany
Abstract
The race to 800 PPI and higher in mobile devices and the transition to OLED displays are driving a dramatic development of mask quality: resolution, CDU, registration, and complexity. 2D metrology for large area masks is necessary and must follow the roadmap. Driving forces in the market place point to continued development of even more dense displays. State-of-the-art metrology has proven itself capable of overlay below 40 nm and registration below 65 nm for G6 masks.

Future developments include incoming and recurrent measurements of pellicalized masks at the panel maker’s factory site. Standardization of coordinate systems across supplier networks is feasible. This will enable better yield and production economy for both mask and panel maker. Better distortion correction methods will give better registration on the panels and relax the flatness requirements of the mask blanks. If panels are measured together with masks and the results are used to characterize the aligners, further quality and yield improvements are possible.

Possible future developments include in-cell metrology and integration with other instruments in the same platform.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tor Sandstrom, Mikael Wahlsten, Youngjin Park, "The future of 2D metrology for display manufacturing ", Proc. SPIE 10032, 32nd European Mask and Lithography Conference, 1003208 (20 October 2016); doi: 10.1117/12.2248951; https://doi.org/10.1117/12.2248951
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