20 October 2016 Photonic integrated circuits: new challenges for lithography
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Proceedings Volume 10032, 32nd European Mask and Lithography Conference; 100320D (2016) https://doi.org/10.1117/12.2248325
Event: 32nd European Mask and Lithography Conference, 2016, Dresden, Germany
Abstract
In this work routes towards the fabrication of photonic integrated circuits (PICs) and the challenges their fabrication poses on lithography, such as large differences in feature dimension of adjacent device features, non-Manhattan-type features, high aspect ratios and significant topographic steps as well as tight lithographic requirements with respect to critical dimension control, line edge roughness and other key figures of merit not only for very small but also for relatively large features, are highlighted. Several ways those challenges are faced in today’s low-volume fabrication of PICs, including the concept multi project wafer runs and mix and match approaches, are presented and possible paths towards a real market uptake of PICs are discussed.
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Jens Bolten, Jens Bolten, Thorsten Wahlbrink, Thorsten Wahlbrink, Andreas Prinzen, Andreas Prinzen, Caroline Porschatis, Caroline Porschatis, Holger Lerch, Holger Lerch, Anna Lena Giesecke, Anna Lena Giesecke, } "Photonic integrated circuits: new challenges for lithography", Proc. SPIE 10032, 32nd European Mask and Lithography Conference, 100320D (20 October 2016); doi: 10.1117/12.2248325; https://doi.org/10.1117/12.2248325
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