20 March 2017 Front Matter: Volume 10085
This PDF file contains the front matter associated with SPIE Proceedings Volume 10085, including the Title Page, Copyright information, Table of Contents, Introduction (if any), and Conference Committee listing.

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Author(s), “Title of Paper,” in Components and Packaging for Laser Systems III, edited by Alexei L. Glebov, Paul O. Leisher, Proceedings of SPIE Vol. 10085 (SPIE, Bellingham, WA, 2017) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510606111

ISBN: 9781510606128 (electronic)

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  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.


Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Amako, J., 0W

Ashok, Nandam, 14

Assmann, Christian, 05

Bawamia, A., 0F

Bayer, Andreas, 0G

Biesenbach, Jens, 09, 0G

Bodem, Christian, 0G

Bordenyuk, Andrey, 0S

Braglia, Andrea, 08

Brecher, C., 0Y

Brochu, G., 0N

Cheng, Jian, 0D

Crump, P., 02

De La Cruz, Joel, 0M

Demmer, D., 0C

Ding, Jianwu, 0R

Dionne, R., 0N

Divliansky, Ivan, 0P

Dürsch, Sascha, 0G

Elizarov, Valentin, 12

Farries, Mark, 0Q

Faßbender, Wilhelm, 09, 0G

Faucher, M., 0N

Forrer, H., 0B

Forrer, M., 0B

Gadonas, Roaldas, 10

Gailevičius, Darius, 10

Gapontsev, Valentin, 0M, 0S

Giudice, A., 0C

Glebov, Leonid B., 0P

Grishkanich, Aleksandr, 12

Han, Seungryong, 14

Haslett, T., 0C

Hauschild, Dirk, 0J

Hayakawa, Tomohiko, 0Z

Hettler, N., 0Y

Hofmann, Julian, 06

Huber, M., 0B

Hubrich, Ralf, 0G

Iakovlev, Alexey, 12

Ishikawa, Masatoshi, 0Z

Jedrzejczyk, Daniel, 06

Jia, Guannan, 0D

Jimenez, Alvaro, 05

Kascheev, Sergey V., 12

Kernke, R., 02

Kindervater, Tobias, 0G

Kissel, Heiko, 09

Könning, Tobias, 09, 0G

Köhler, Bernd, 0G

Kompan, Fedor, 0P

Krüger, M., 0F

Kürbis, Ch., 0F

Küster, Matthias, 0G

Laskin, Alexander, 0K

Laskin, Vadim, 0K

Lee, Yeung Lak, 14

Legg, Thomas, 0Q

Liang, Xuejie, 04, 0I

Liu, Hui, 04

Liu, Jinghui, 0R

Liu, Xingsheng, 04, 0A, 0I

Liu, Yalong, 04

Lotz, Jens, 09

Luo, Xiaoying, 0D

Mahnkopf, S., 0C

Mak, Andrey, 12

Milde, Tobias, 05

Morin, M., 0N

Moser, H., 0B

Müller, T., 0Y

Nakano, Hitoshi, 13

Nie, Zhiqiang, 0I

O'Gorman, James, 05

Ostrun, Aleksei, 0K

Paschke, Katrin, 06

Patterson, Steve, 09

Peckus, Martynas, 10

Perrone, Guido, 08

Peters, A., 0F

Plappert, Nora, 0G

Platonov, Nikolai, 0M

Purlys, Vytautas, 10

Rieprich, J., 02

Rossi, Giammarco, 08

Sacher, Joachim R., 05

Sahm, Alexander, 06

Samartsev, Igor, 0S

Sauer, S., 0Y

Schiemangk, M., 0F

Shin, WooJin, 14

Simmerle, G., 0C

Smirnov, Leonid, 12

Smirnov, Vadim, 0P

Smol, R., 0F

Staacke, Niklas, 05

Staliunas, Kestutis, 10

Tanaka, Miyu, 13

Tei, Masaya, 13

Tomm, J., 02

Tränkle, G., 0F

Trépanier, F., 0N

Uno, Kazuyuki, 13

Villeneuve, A., 0N

Wang, Jingwei, 04, 0A, 0I

Wang, Zhiyong, 0D

Wei, Xi, 0R

Werner, Nils, 06

Wicht, A., 0F

Winterfeldt, M., 02

Wolf, Paul, 0G

Wu, Dihai, 04, 0I

Wuest, P., 0B

Xu, Jun, 0R

Yagodkin, Roman, 0M

Yao, Shun, 0D

Yu, Dongshan, 04

Yu, Hao, 08

Yusim, Alexander, 0M

Zah, Chung-en, 04

Zhang, Pu, 0A, 0I

Zhevlakov, Aleksandr, 12

Zhu, Pengfei, 04

Zhu, Qiwen, 0A

Zontar, D., 0Y

Conference Committee

Symposium Chairs

  • Reinhart Poprawe, Fraunhofer-Institut für Lasertechnik (Germany)

  • Koji Sugioka, RIKEN (Japan)

Symposium Co-chairs

  • Guido Hennig, Daetwyler Graphics AG (Switzerland)

  • Yongfeng Lu, University of Nebraska-Lincoln (United States)

Program Track Chairs

  • Kunihiko Washio, Paradigm Laser Research Ltd. (Japan)

  • John Ballato, Clemson University (United States)

Conference Chairs

  • Alexei L. Glebov, OptiGrate Corporation (United States)

  • Paul O. Leisher, Rose-Hulman Institute of Technology (United States)

Conference Program Committee

  • Igor Anisimov, Air Force Research Laboratory (United States)

  • Gunnar Böttger, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)

  • Kristian J. Buchwald, Ibsen Photonics A/S (Denmark)

  • Te-Yuan Chung, National Central University (Taiwan, China)

  • Joseph L. Dallas, Avo Photonics, Inc. (United States)

  • Allen M. Earman, AOSense, Inc. (United States)

  • Martin Forrer, FISBA AG (Switzerland)

  • Alexander V. Laskin, AdlOptica Optical Systems GmbH (Germany)

  • Xingsheng Liu, Xi'an Institute of Optics and Precision Mechanics (China)

  • Jens Meinschien, LIMO Lissotschenko Mikrooptik GmbH (Germany)

  • Christian V. Poulsen, NKT Photonics Inc. (United States)

  • Mark A. Stephen, NASA Goddard Space Flight Center (United States)

  • Takunori Taira, Institute for Molecular Science (Japan)

  • Torsten Vahrenkamp, ficonTEC Service GmbH (Germany)

  • Alexander Yusim, IPG Photonics Corporation (United States)

  • Chungen Zah, Focuslight Technologies, Inc. (China)

  • Arnaud Zoubir, ALPhANOV (France)

Session Chairs

  • 1 Laser Diode Packaging I: Joint Session with Conferences 10085 and 10086

    Paul O. Leisher, Rose-Hulman Institute of Technology (United States)

    Robert Martinsen, nLIGHT Corporation (United States)

  • 2 Laser Diode Packaging II

    Martin Forrer, FISBA AG (Switzerland)

  • 3 Laser Diode Packaging III

    Chungen Zah, Focuslight Technologies, Inc. (China)

  • 4 Laser Diode Packaging IV

    Joseph L. Dallas, Avo Photonics, Inc. (United States)

  • 5 Components and Packaging for High Power/Energy Lasers I

    Christian V. Poulsen, NKT Photonics Inc. (United States)

  • 6 Components and Packaging for High Power/Energy Lasers II

    Alexander V. Laskin, AdlOptica Optical Systems GmbH (Germany)

  • 7 Components and Packaging for Pulsed High Power/Energy Lasers

    Alexander Yusim, IPG Photonics Corporation (United States)

  • 8 Components and Packaging for Laser Beam Engineering

    Evan Robert Hale, CREOL, University of Central Florida (United States)

© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 10085", Proc. SPIE 10085, Components and Packaging for Laser Systems III, 1008501 (20 March 2017); doi: 10.1117/12.2276037; https://doi.org/10.1117/12.2276037

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