17 February 2017 Laser micro-machining strategies for transparent brittle materials using ultrashort pulsed lasers
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Abstract
Cutting and drilling of transparent materials using short pulsed laser systems are important industrial production processes. Applications ranging from sapphire cutting, hardened glass processing, and flat panel display cutting, to diamond processing are possible.

The ablation process using a Gaussian laser beam incident on the topside of a sample with several parallel overlapping lines leads to a V-shaped structured groove. This limits the structuring depth for a given kerf width. The unique possibility for transparent materials to start the ablation process from the backside of the sample is a well-known strategy to improve the aspect ratio of the ablated features. This work compares the achievable groove depth depending on the kerf width for front-side and back-side ablation and presents the best relation between the kerf width and number of overscans. Additionally, the influence of the number of pulses in one burst train on the ablation efficiency is investigated. The experiments were carried out using Spirit HE laser from Spectra-Physics, with the features of adjustable pulse duration from <400 fs to 10 ps, three different repetition rates (100 kHz, 200 kHz and 400 kHz) and average output powers of >16 W ( at 1040 nm wavelength).
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Benjamin Bernard, Benjamin Bernard, Victor Matylitsky, Victor Matylitsky, } "Laser micro-machining strategies for transparent brittle materials using ultrashort pulsed lasers", Proc. SPIE 10092, Laser-based Micro- and Nanoprocessing XI, 1009205 (17 February 2017); doi: 10.1117/12.2252105; https://doi.org/10.1117/12.2252105
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