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17 February 2017 Selective metallization based on laser direct writing and additive metallization process
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The selective metallization on a flexible polymer film via laser direct writing and the following additive metallization process was studied as an alternate to conventional semi-additive process in the fabrication of printed circuit board. A Cu micropattern was fabricated on a polyimide film via CW blue-violet laser direct writing using a Cu nanoparticle ink and applied to a seed layer for the Cu electroplating. The on-demand processing of a Cu micropattern whose line width and thickness are ca. 5 and 2 μm, respectively, was achieved by combination of a laser-written seed micropattern and the following electro-plating. The homogeneity of the Cu micropatterns prepared from Cu nanoparticles was easily improved by combination with the following Cu plating.
Conference Presentation
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Akira Watanabe and Jinguang Cai "Selective metallization based on laser direct writing and additive metallization process", Proc. SPIE 10092, Laser-based Micro- and Nanoprocessing XI, 100920Z (17 February 2017);

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