17 February 2017 Ultra-short pulse laser micro patterning with highest throughput by utilization of a novel multi-beam processing head
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In the last decade much improvement has been achieved for ultra-short pulse lasers with high repetition rates. This laser technology has vastly matured so that it entered a manifold of industrial applications recently compared to mainly scientific use in the past. Compared to ns-pulse ablation ultra-short pulses in the ps- or even fs regime lead to still colder ablation and further reduced heat-affected zones. This is crucial for micro patterning when structure sizes are getting smaller and requirements are getting stronger at the same time. An additional advantage of ultra-fast processing is its applicability to a large variety of materials, e.g. metals and several high bandgap materials like glass and ceramics.

One challenge for ultra-fast micro machining is throughput. The operational capacity of these processes can be maximized by increasing the scan rate or the number of beams – parallel processing. This contribution focuses on process parallelism of ultra-short pulsed lasers with high repetition rate and individually addressable acousto-optical beam modulation. The core of the multi-beam generation is a smooth diffractive beam splitter component with high uniform spots and negligible loss, and a prismatic array compressor to match beam size and pitch. The optical design and the practical realization of an 8 beam processing head in combination with a high average power single mode ultra-short pulsed laser source are presented as well as the currently on-going and promising laboratory research and micro machining results. Finally, an outlook of scaling the processing head to several tens of beams is given.
Conference Presentation
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Oliver Homburg, Oliver Homburg, Manfred Jarczynski, Manfred Jarczynski, Thomas Mitra, Thomas Mitra, Stephan Brüning, Stephan Brüning, } "Ultra-short pulse laser micro patterning with highest throughput by utilization of a novel multi-beam processing head", Proc. SPIE 10092, Laser-based Micro- and Nanoprocessing XI, 100921C (17 February 2017); doi: 10.1117/12.2255707; https://doi.org/10.1117/12.2255707

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