High-aspect ratio laser drilling of glass assisted by supercritical carbon dioxide

Keisuke Yoshiki

doi:10.1117/12.2248515

17 February 2017 High-aspect ratio laser drilling of glass assisted by supercritical carbon dioxide

Keisuke Yoshiki

Proceedings Volume 10092, Laser-based Micro- and Nanoprocessing XI; 100921K (2017) https://doi.org/10.1117/12.2248515
Event: SPIE LASE, 2017, San Francisco, California, United States

Abstract

We propose a novel high aspect laser drilling technique for glass substrate assisted by supercritical CO₂ instead of water. Supercritical CO₂ has excellent solubility and fluidity, which facilitates efficient removal of ablated debris to the outside of the drilled hole. Thus, laser drilling using supercritical CO₂ results in deeper, thinner holes than those drilled using air and water. In experiments conducted, glass slab was placed in an enclosure filled with CO₂ around the critical point. Subsequently, a sub-picosecond pulsed laser focused and scanned on the sample created deeper and thinner holes with aspect ratios greater than 100.

Citation Download Citation

Keisuke Yoshiki "High-aspect ratio laser drilling of glass assisted by supercritical carbon dioxide", Proc. SPIE 10092, Laser-based Micro- and Nanoprocessing XI, 100921K (17 February 2017); https://doi.org/10.1117/12.2248515

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