17 February 2017 High-aspect ratio laser drilling of glass assisted by supercritical carbon dioxide
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Abstract
We propose a novel high aspect laser drilling technique for glass substrate assisted by supercritical CO2 instead of water. Supercritical CO2 has excellent solubility and fluidity, which facilitates efficient removal of ablated debris to the outside of the drilled hole. Thus, laser drilling using supercritical CO2 results in deeper, thinner holes than those drilled using air and water. In experiments conducted, glass slab was placed in an enclosure filled with CO2 around the critical point. Subsequently, a sub-picosecond pulsed laser focused and scanned on the sample created deeper and thinner holes with aspect ratios greater than 100.
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Keisuke Yoshiki, "High-aspect ratio laser drilling of glass assisted by supercritical carbon dioxide", Proc. SPIE 10092, Laser-based Micro- and Nanoprocessing XI, 100921K (17 February 2017); doi: 10.1117/12.2248515; https://doi.org/10.1117/12.2248515
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