22 February 2017 193nm high power lasers for the wide bandgap material processing
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Abstract
Recently infrared laser has faced resolution limit of finer micromachining requirement on especially semiconductor packaging like Fan-Out Wafer Level Package (FO-WLP) and Through Glass Via hole (TGV) which are hard to process with less defect. In this study, we investigated ablation rate with deep ultra violet excimer laser to explore its possibilities of micromachining on organic and glass interposers. These results were observed with a laser microscopy and Scanning Electron Microscope (SEM). As the ablation rates of both materials were quite affordable value, excimer laser is expected to be put in practical use for mass production.
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Junichi Fujimoto, Junichi Fujimoto, Masakazu Kobayashi, Masakazu Kobayashi, Koji Kakizaki, Koji Kakizaki, Hiroaki Oizumi, Hiroaki Oizumi, Toshio Mimura, Toshio Mimura, Takashi Matsunaga, Takashi Matsunaga, Hakaru Mizoguchi, Hakaru Mizoguchi, } "193nm high power lasers for the wide bandgap material processing", Proc. SPIE 10097, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VI, 100970T (22 February 2017); doi: 10.1117/12.2250706; https://doi.org/10.1117/12.2250706
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