22 February 2017 Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes
Author Affiliations +
Proceedings Volume 10098, Physics and Simulation of Optoelectronic Devices XXV; 1009829 (2017); doi: 10.1117/12.2256112
Event: SPIE OPTO, 2017, San Francisco, California, United States
Abstract
High power laser diodes have found a wide range of industrial, space, medical applications, characterized by high conversion efficiency, small size, light weight and a long lifetime. In this investigation, high power 940 nm laser bars were mounted on optimized micro-channel heat sinks (MCC) using AuSn/CuW and In Soldering schemes. The optimized MCC cooler has decreased pressure drop and increased heat-sinking capability. The improvements in thermal and strain characteristics will be reported through wavelength, thermal rollover, spatial spectrum, SMILE, and polarization.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hongyou Zhang, Xuejie Liang, Wanshao Cai, Chungen Zah, Xingsheng Liu, "Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes", Proc. SPIE 10098, Physics and Simulation of Optoelectronic Devices XXV, 1009829 (22 February 2017); doi: 10.1117/12.2256112; http://dx.doi.org/10.1117/12.2256112
PROCEEDINGS
11 PAGES


SHARE
KEYWORDS
Indium

Semiconductor lasers

Copper

High power lasers

Laser bonding

Near field

Continuous wave operation

Back to Top