16 February 2017 Hybrid III-V/silicon photonic integrated circuits for high bitrates telecommunication applications
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Abstract
We report on our recent advances on integrated hybrid InP/SOI transmitters using the Silicon Photonic fabrication technology. We demonstrate the direct modulation at 10 Gbits/s of different laser configurations such as wavelength tunable lasers, Distributed FeedBack (DFB) lasers and Chirp Managed Lasers (CMLs). We will also present the design, fabrication and characterization of various hybrid InP/SOI transmitters integrating lasers (tunable or DFB) and modulators (silicon or III-V) with modulation up to 32 Gbits/s.
Conference Presentation
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David Carrara, Alexandre Shen, Xavier Pommarede, Guillaume Levaufre, Nils Girard, Dalila Make, Geneviève Glastre, Jean Decobert, François Lelarge, Romain Brenot, Ségolène Olivier, Christophe Jany, Stéphane Malhouitre, Benoit Charbonnier, Christophe Kopp, Guang-Hua Duan, "Hybrid III-V/silicon photonic integrated circuits for high bitrates telecommunication applications", Proc. SPIE 10106, Integrated Optics: Devices, Materials, and Technologies XXI, 101060G (16 February 2017); doi: 10.1117/12.2250129; https://doi.org/10.1117/12.2250129
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