16 February 2017 Hybrid III-V/silicon photonic integrated circuits for high bitrates telecommunication applications
Author Affiliations +
We report on our recent advances on integrated hybrid InP/SOI transmitters using the Silicon Photonic fabrication technology. We demonstrate the direct modulation at 10 Gbits/s of different laser configurations such as wavelength tunable lasers, Distributed FeedBack (DFB) lasers and Chirp Managed Lasers (CMLs). We will also present the design, fabrication and characterization of various hybrid InP/SOI transmitters integrating lasers (tunable or DFB) and modulators (silicon or III-V) with modulation up to 32 Gbits/s.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Carrara, David Carrara, Alexandre Shen, Alexandre Shen, Xavier Pommarede, Xavier Pommarede, Guillaume Levaufre, Guillaume Levaufre, Nils Girard, Nils Girard, Dalila Make, Dalila Make, Geneviève Glastre, Geneviève Glastre, Jean Decobert, Jean Decobert, François Lelarge, François Lelarge, Romain Brenot, Romain Brenot, Ségolène Olivier, Ségolène Olivier, Christophe Jany, Christophe Jany, Stéphane Malhouitre, Stéphane Malhouitre, Benoit Charbonnier, Benoit Charbonnier, Christophe Kopp, Christophe Kopp, Guang-Hua Duan, Guang-Hua Duan, } "Hybrid III-V/silicon photonic integrated circuits for high bitrates telecommunication applications", Proc. SPIE 10106, Integrated Optics: Devices, Materials, and Technologies XXI, 101060G (16 February 2017); doi: 10.1117/12.2250129; https://doi.org/10.1117/12.2250129


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