20 February 2017 Integration and modeling of photonic devices suitable for high performance computing and data center applications
Author Affiliations +
Proceedings Volume 10108, Silicon Photonics XII; 1010819 (2017) https://doi.org/10.1117/12.2249851
Event: SPIE OPTO, 2017, San Francisco, California, United States
We report a 200 mm silicon photonic platform integrating a set of devices dedicated on HPC applications. PiN microring modulator layout and process are optimized together. Active tuning through heating section is investigated using either doped silicon or metal resistors. This technology is supported by a dedicated process design kit (PDK) compatible with conventional CMOS EDA tools. The PDK includes optical device models that will be described and compared with experimental results. A focus will be done on the PiN micro-ring modulator models which covering a wide range of geometries. DC mode and RF behaviors are supported.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. Szelag, B. Szelag, M. A. Seyedi, M. A. Seyedi, A. Myko, A. Myko, B. Blampey, B. Blampey, A. Descos, A. Descos, Chin-Hui Chen, Chin-Hui Chen, S. Brision, S. Brision, F. Gays, F. Gays, M. Fiorentino, M. Fiorentino, Ray Beausoleil, Ray Beausoleil, C. Kopp, C. Kopp, } "Integration and modeling of photonic devices suitable for high performance computing and data center applications", Proc. SPIE 10108, Silicon Photonics XII, 1010819 (20 February 2017); doi: 10.1117/12.2249851; https://doi.org/10.1117/12.2249851


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