Evaluation of hybrid polymers for high-precision manufacturing of 3D optical interconnects by two-photon absorption lithography

A. Schleunitz; J. J. Klein; A. Krupp; B. Stender; R. Houbertz; G. Gruetzner

doi:10.1117/12.2252318

20 February 2017 Evaluation of hybrid polymers for high-precision manufacturing of 3D optical interconnects by two-photon absorption lithography

A. Schleunitz, J. J. Klein, A. Krupp, B. Stender, R. Houbertz, G. Gruetzner

Author Affiliations +

Proceedings Volume 10109, Optical Interconnects XVII; 1010905 (2017) https://doi.org/10.1117/12.2252318
Event: SPIE OPTO, 2017, San Francisco, California, United States

Abstract

The fabrication of optical interconnects has been widely investigated for the generation of optical circuit boards. Twophoton absorption (TPA) lithography (or high-precision 3D printing) as an innovative production method for direct manufacture of individual 3D photonic structures gains more and more attention when optical polymers are employed. In this regard, we have evaluated novel ORMOCER-based hybrid polymers tailored for the manufacture of optical waveguides by means of high-precision 3D printing. In order to facilitate future industrial implementation, the processability was evaluated and the optical performance of embedded waveguides was assessed. The results illustrate that hybrid polymers are not only viable consumables for industrial manufacture of polymeric micro-optics using generic processes such as UV molding. They also are potential candidates to fabricate optical waveguide systems down to the chip level where TPA-based emerging manufacturing techniques are engaged. Hence, it is shown that hybrid polymers continue to meet the increasing expectations of dynamically growing markets of micro-optics and optical interconnects due to the flexibility of the employed polymer material concept.

Conference Presentation

Citation Download Citation

A. Schleunitz, J. J. Klein, A. Krupp, B. Stender, R. Houbertz, and G. Gruetzner "Evaluation of hybrid polymers for high-precision manufacturing of 3D optical interconnects by two-photon absorption lithography", Proc. SPIE 10109, Optical Interconnects XVII, 1010905 (20 February 2017); https://doi.org/10.1117/12.2252318

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available