20 February 2017 Laser subtractive-additive-welding microfabrication for Lab-On-Chip (LOC) applications
Author Affiliations +
An approach employing ultrafast laser hybrid microfabrication combining ablation, 3D nanolithography and welding is proposed for the realization of Lab-On-Chip (LOC) device. The same laser setup is shown to be suitable for fabricating microgrooves in glass slabs, polymerization of fine meshes inside them, and, lastly, sealing the whole chip with cover glass into one monolithic piece. The created micro fluidic device proved its particle sorting function by separating 1 μm and 10 μm polystyrene spheres from a mixture. Next, a lens adapter for a cell phone's camera was manufactured via thermal extrusion 3D printing technique which allowed to achieve sufficient magnification to clearly resolve <10 μm features. All together shows fs-laser microfabrication technology as a flexible and versatile tool for study and manufacturing of Lab-On-Chip devices.
Conference Presentation
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Linas Jonušauskas, Linas Jonušauskas, Sima Rekštytė, Sima Rekštytė, Ričardas Buivydas, Ričardas Buivydas, Simas Butkus, Simas Butkus, Domas Paipulas, Domas Paipulas, Roaldas Gadonas, Roaldas Gadonas, Saulius Juodkazis, Saulius Juodkazis, Mangirdas Malinauskas, Mangirdas Malinauskas, } "Laser subtractive-additive-welding microfabrication for Lab-On-Chip (LOC) applications", Proc. SPIE 10115, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics X, 101150V (20 February 2017); doi: 10.1117/12.2249828; https://doi.org/10.1117/12.2249828

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