20 February 2017 Reliability evaluation of a MEMS scanner
Author Affiliations +
Proceedings Volume 10116, MOEMS and Miniaturized Systems XVI; 1011606 (2017) https://doi.org/10.1117/12.2252191
Event: SPIE OPTO, 2017, San Francisco, California, United States
Previously, the realization and closed loop control of a MEMS scanner integrating position sensors made with piezoresistive sensors was presented. It consisted of a silicon compliant membrane with integrated position sensors, on which a mirror and a magnet were assembled. This device was mounted on a PCB containing coils for electromagnetic actuation. In this work, the reliability of such system was evaluated through thermal and mechanical analysis. The objective of thermal analysis was to evaluate the lifetime of the MEMS scanner and is consisting of temperature cycling (-40°C to 100°C) and accelerated electrical endurance (100°C with power supplied to all electrical components). The objective of mechanical analysis was to assess the resistance of the system to mechanical stress and is consisting of mechanical shock and vibration. A high speed camera has been used to observe the behavior of the MEMS scanner. The use of shock stopper to improve the mechanical resistance has been evaluated and had demonstrated a resistance increase from 250g to 900g. The minimum shock resistance required for the system is 500g for transportation and 1000g for portative devices.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. Lani, S. Lani, Y. Marozau, Y. Marozau, M. Dadras, M. Dadras, } "Reliability evaluation of a MEMS scanner", Proc. SPIE 10116, MOEMS and Miniaturized Systems XVI, 1011606 (20 February 2017); doi: 10.1117/12.2252191; https://doi.org/10.1117/12.2252191


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