16 February 2017 Validation of thermal effects of LED package by using Elmer finite element simulation method
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The overall performance of the Light-emitting diode, LED package is critically affected by the heat attribution. In this study, open source software - Elmer FEM has been utilized to study the thermal analysis of the LED package. In order to perform a complete simulation study, both Salome software and ParaView software were introduced as Pre and Postprocessor. The thermal effect of the LED package was evaluated by this software. The result has been validated with commercially licensed software based on previous work. The percentage difference from both simulation results is less than 5% which is tolerable and comparable.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lai Siang Leng, Lai Siang Leng, Vithyacharan Retnasamy, Vithyacharan Retnasamy, Mukhzeer Mohamad Shahimin, Mukhzeer Mohamad Shahimin, Zaliman Sauli, Zaliman Sauli, Steven Taniselass, Steven Taniselass, Muhamad Hafiz Bin Ab Aziz, Muhamad Hafiz Bin Ab Aziz, Rajendaran Vairavan, Rajendaran Vairavan, Supap Kirtsaeng, Supap Kirtsaeng, } "Validation of thermal effects of LED package by using Elmer finite element simulation method", Proc. SPIE 10124, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XXI, 101241M (16 February 2017); doi: 10.1117/12.2257216; https://doi.org/10.1117/12.2257216

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