16 February 2017 Validation of thermal effects of LED package by using Elmer finite element simulation method
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Abstract
The overall performance of the Light-emitting diode, LED package is critically affected by the heat attribution. In this study, open source software - Elmer FEM has been utilized to study the thermal analysis of the LED package. In order to perform a complete simulation study, both Salome software and ParaView software were introduced as Pre and Postprocessor. The thermal effect of the LED package was evaluated by this software. The result has been validated with commercially licensed software based on previous work. The percentage difference from both simulation results is less than 5% which is tolerable and comparable.
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Lai Siang Leng, Vithyacharan Retnasamy, Mukhzeer Mohamad Shahimin, Zaliman Sauli, Steven Taniselass, Muhamad Hafiz Bin Ab Aziz, Rajendaran Vairavan, Supap Kirtsaeng, "Validation of thermal effects of LED package by using Elmer finite element simulation method", Proc. SPIE 10124, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XXI, 101241M (16 February 2017); doi: 10.1117/12.2257216; https://doi.org/10.1117/12.2257216
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