28 January 2017 Cost-effective light-emission optical sub-assembly for datacenter networks
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Abstract
Technologies for creating cost-effective light-emission optical sub-assemblies (OSAs) are discussed from the point of view of laser diodes. A lens-integrated surface-emitting laser (LISEL), consisting of a DFB laser, integrated mirror, and integrated convex lens, has the potential to achieve light-emission OSAs. An OSA based on the LISEL is proposed, and the capabilities of direct and passively aligned optical coupling, isolator-free operation, non-hermetic packaging, and on-wafer testing are introduced.
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T. Suzuki, T. Suzuki, K. Adachi, K. Adachi, K. R. Tamura, K. R. Tamura, A. Nakanishi, A. Nakanishi, K. Naoe, K. Naoe, K. Nakahara, K. Nakahara, S. Tanaka, S. Tanaka, } "Cost-effective light-emission optical sub-assembly for datacenter networks", Proc. SPIE 10131, Next-Generation Optical Networks for Data Centers and Short-Reach Links IV, 101310B (28 January 2017); doi: 10.1117/12.2249971; https://doi.org/10.1117/12.2249971
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