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Correlation of experimentally measured atomic scale properties of EUV photoresist to modeling performance: an exploration
Modeling EUVL patterning variability for metal layers in 5nm technology node and its effect on electrical resistance
High-volume manufacturing compatible dry development rinse process (DDRP): patterning and defectivity performance for EUVL
N7 dark field two-bar in 0.33NA EUVL: Mitigation of CD Bossung tilts caused by strong coupling between the feature's primary and 1st self-image
Rigorous 3D electromagnetic simulation of ultrahigh efficiency EUV contact-hole printing with chromeless phase shift mask
Minimizing wafer overlay errors due to EUV mask non-flatness and thickness variations for N7 production