In this paper, we review key defectivity learning required to enable 7nm node and beyond technology. We will describe ongoing progress in addressing these challenges through track-based processes (coating, developer, baking), highlighting the limitations of common defect detection strategies and outlining methodologies necessary for accurate characterization and mitigation of blanket defectivity in EUV patterning stacks. We will further discuss defects related to pattern collapse and thinning of underlayer films.
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Luciana Meli, Karen Petrillo, Anuja De Silva, John Arnold, Nelson Felix, Richard Johnson, Cody Murray, Alex Hubbard, Danielle Durrant, Koichi Hontake, Lior Huli, Corey Lemley, Dave Hetzer, Shinichiro Kawakami, Koichi Matsunaga, "Driving down defect density in composite EUV patterning film stacks," Proc. SPIE 10143, Extreme Ultraviolet (EUV) Lithography VIII, 101430Y (28 March 2017);